Die Placement Advancement for Prevention of Silhouetted Die Occurrence on LGA Package

Rodriguez, Rennier and Gomez, Frederick Ray and Graycochea Jr., Edwin (2021) Die Placement Advancement for Prevention of Silhouetted Die Occurrence on LGA Package. Journal of Engineering Research and Reports, 20 (2). pp. 113-117. ISSN 2582-2926

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Abstract

In semiconductor packaging industry, silhouetted die defect is occasionally encountered in singulation process esp. on substrate land grid array (LGA) package with tight clearances. This paper is focused on the prevention of the silhouetted die occurrence as it would affect the assembly yield performance of the device. The silhouetted die is caused by the tight clearance of die edge to package edge, given the machine and process tolerances. Process enhancement and optimization were done through adjusting the die placement accordingly as per the defined measurement. Eventually, the occurrence of silhouetted die was successfully mitigated by formulating the appropriate die placement references.

Item Type: Article
Subjects: GO for STM > Engineering
Depositing User: Unnamed user with email support@goforstm.com
Date Deposited: 20 Mar 2023 06:20
Last Modified: 02 Sep 2023 07:13
URI: http://archive.article4submit.com/id/eprint/160

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