Development of Ready to Cook (RTC) Pasta and Vermicelli from Kodo Millet (Paspalum scorbiculatum) Using Cold Extrusion Technology

Biradar, Vishwaradhya M and Kumargouda, Viresh and ., Suresha K. B and ., Mohithkumar G.V and ., Shobha D (2024) Development of Ready to Cook (RTC) Pasta and Vermicelli from Kodo Millet (Paspalum scorbiculatum) Using Cold Extrusion Technology. Journal of Advances in Biology & Biotechnology, 27 (8). pp. 69-80. ISSN 2394-1081

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Abstract

Pasta and vermicelli products are in high demand worldwide and serve as effective carriers for delivering nutrition. This study focused on developing pasta and vermicelli using kodo millet and whole wheat flour, by investigating four different formulations. Based on cooking and sensory attributes, the pasta and vermicelli were optimised. With cold extrudates containing 60 % of kodo millet flour and 40 % of whole wheat flour (T4) showed superior characteristics compared to other treatments. The optimised cold extruded products were analysed for physico-chemical and proximate according to Deshpande and Poshadri (2011), Launay and Lisch (1983), Anderson (1982), AOAC (1980) respectively and 9-point hedonic scale was used to adjudge the sensory characteristics and also studied cooking characteristics according to standard methodologies. In which they (both pasta and vermicelli) showed similar (on far) physico-functional characteristics. The optimised pasta and vermicelli were then stored in metallized polyester pouches (50 µm thickness) under ambient conditions for three months. During this storage period, parameters such as moisture content and sensory attributes were monitored at 15-day intervals to assess the stability of the cold extruded products. The study provides valuable insights into the development and storage stability of nutritious pasta and vermicelli products made from kodo millet and whole wheat flour.

Item Type: Article
Subjects: GO for STM > Biological Science
Depositing User: Unnamed user with email support@goforstm.com
Date Deposited: 12 Jul 2024 05:32
Last Modified: 12 Jul 2024 05:32
URI: http://archive.article4submit.com/id/eprint/2929

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